PEP INNOVATION PTE. LTD.

PEP Innovation Pte Ltd is a Singapore-based Technology Development Company, founded by ex-APS* engineers & scientist. It has Innovative Technology & Patents in embedded & system integration package. Vision to create next generation of panel-based embedded packaging (FOWLP). Mission to be the leader in innovation, creation and delivery of PEPs technology to the world *APS is the inventor of Cu Pillar Bump (CuP) & Molded Interconnect Substrate (MIS)